Mosin Mondal

Electronic Design Automation (EDA) Engineer

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Curriculam Vitae: PDF  Word

 

Areas of Interest

 

On-chip and off-chip power and signal integrity, circuit-electromagnetic co-simulation, computational geometry, DRC checking, interconnect modeling, CAD for VLSI systems.

 

Education

 

PhD in Electrical Engineering

 University of Washington, Seattle, USA (March 2007 - December 2009)

Dissertation Title: Computational Techniques for Power and Signal Integrity in Packaged Microelectronics

Advisor: Prof. Vikram Jandhyala

 

MS in Electrical and Computer Engineering

Rice University, Houston, USA (August 2004 – February 2007)

GPA: 4.0/4.0

 

BE (Honors) in Electronics and Telecommunication Engineering

 Jadavpur University, Calcutta, India (July 1997 – June 2001)

 GPA: 3.83/4.0

 

Industrial Experience

 

Cadence Design Systems (I) Pvt. Ltd, NOIDA, India, as Member of Consulting Staff (January 2010 – present)  

– In the development group of Virtuoso Space Based Router and Design Rule Checker

 

IBM Corporation, RTP, USA as Technical Co-op (June – December, 2007) in the tools development group:

 

PowerPEEC (IBM's full wave circuit-EM simulation tool)

 

§ Enhanced the efficiency, robustness and stability of the core engine of the tool

§ Significantly reduced the computation time for partial inductance and capacitance

§ Modeled and simulated different board and package components using PowerPEEC

 

Crosstalk aware rule checking in board level

 

§ Efficient crosstalk aware rule checking

§ Developed method for fast estimation of parasitic elements for striplines and microstrips

§ Implemented fast crosstalk estimation algorithm

 

Analysis of non-ideal common ground connection in multi-board PCBs

 

§ Analysis of SI and EMI issues due to non-ideal  “common ground” in multi-board PCBs

§ Efficient inductance estimation for connector pins that cause impedance discontinuity

§ Optimal pin-assignment to reduce electromagnetic interference

 

Cadence Design Systems (I) Pvt. Ltd, NOIDA, India, as Software Engineer (July 2001 – March 2003) and
      Member of Technical Staff (April 2003 – May 2004) in the development team of:

 

CeltIC [Currently part of Encounter Timing System (ETS)] (Crosstalk glitch and delay analyzer, 2002-2004)

§ Worked on cell characterization techniques

§ Worked on noise and delay computation modules

§ Developed techniques for incorporating on-chip variation (OCV) effects

§ Gained overall knowledge of the entire flow and experience using Berkeley SPICE engine

 

PCB Librarian Expert (Cell library creation and management tool for PCB, 2001)

§ Designed and implemented basic data structures around Microsoft Foundation Classes (MFC)

§ Designed and implemented different parser modules

§ Designed and implemented generic, configurable graphical interfaces

§ Developed different import/export modules for interlibrary and inter-tool cell exchange

Graduate Research Experience

 

·    Power integrity (PI) modeling and simulation in package and board levels (2008-2009)

 

§ Modeling of power delivery networks for power integrity analysis

§ Development of a full-fledged simulation tool in C++ for PI analysis

§ Efficient finite difference scheme for analyzing real-life boards and packages

§ Macromodeling technique for decoupling capacitor optimization

 

·    Ray tracing for radio frequency identification (RFID) systems (2009)

 

§ Estimation of field and power at any location in a given site

§ Development of a ray tracing tool in C++

·    Analytical modeling of on-chip inductance (2004-2005)

 

§ Development of an analytical model for on-chip frequency dependent loop self-inductance

§ Modeling based on generalizing the response of simple loops to more complicated loops

§ Can be applied for accurate RLC wire delay estimation of a wide range of wire geometries

 

·    Design of thermally robust clock tree (2006-2007)

 

§ Analysis of temperature gradient vs. clock skew using BSIM3 device model and PEEC interconnect model

§ Proposed dynamically adaptive technique for minimizing temperature-dependent skew

§ Designed clock buffers that dynamically adjust the driving strength with surrounding temperature

§ Extended the technique for application in 3-D integrated circuits

 

 

·    Analysis of gate-level noise robustness under parameter variations (2006-2007)

 

§ Analysis of noise immunity of digital gates under parameter variations

§ Analytical approach developed for estimating the noise susceptibility of gates

§ Orders of magnitude performance gain over circuit simulations

 

·    Analysis of delay variation in network-on-chip (NoC) interconnects due to process variations (2006)

 

§ Development of Elmore delay-based analytical technique for delay variability in buffered NoC link

§ Estimation of link failure probability due to delay variation

 

·    Analysis of crosstalk induced dynamic power (2006)

 

§ Developed method for estimating the additional switching and short circuit energy

§ Proposed a heuristic for computing the extra energy spent by a switching victim net

 

 

Computer Skills

 

§ Programming Languages: C++, C. Proficient in object oriented programming.

§ Scripting Languages: PERL, TCL

§ Mathematical Tools: MATLAB, Mathematica

§ Circuit and EM Simulation Tools: SPICE, PowerPEEC, PhysWAVE, Ansoft HFSS

§ IC Design Platform: Cadence Virtuoso

§ Operating Systems/Environments: UNIX, Windows

 

Awards and Honors

 

§ IEEE EMC Society President's Memorial Award, 2008-2009 (link)

§ Best Paper Award at the IEEE Electrical Performance of Electronic Packaging (EPEP) Conference, 2007 (link)

§ Research Assistantship, Dept. of EE, University of Washington, 2007 - 2009

§ Rice University Graduate Fellowship, Research Assistantship, 2004-2006

§ Excellence in Execution Award, Cadence Design Systems, 2004

§ 2nd in Bachelor of Engineering in Electronics, Jadavpur University, 2001

§ Governor's Gold Medal for all-round academic performance, 1997

§ 3rd (out of 300,000) in the state of West Bengal in Higher Secondary (10+2) Examination, 1997

§ 4th (out of 50,000) in the West Bengal Joint Entrance Examination, 1997

§ 11th (out of 400,000) in the state of West Bengal in Secondary (10th) Examination, 1995

§ National Talent Scholarship from National Council for Education, Research and Training (NCERT), 1995

 

Publications

 

  1. Mosin Mondal, James Pingenot and Vikram Jandhyala, “Efficient Hierarchical Discretization of Off-chip Power Delivery Network Geometries for 2.5D Electrical Analysis,” in Proceedings of the International Symposium on Quality Electronic Design (ISQED), March 2010.

  2.  Mosin Mondal, Bruce Archambeault and Vikram Jandhyala, “Enabling Early Design of Complex Power Delivery Networks Using Spatially-Nonuniform Finite-Difference Method,” DesignCon, February 2010.

  3. Tamer Ragheb, Andrew Ricketts, Mosin Mondal, Sami Kirolos, Greg Link, Vijaykrishnan Narayanan and Yehia Massoud, “Design of Thermally Robust Clock Trees Using Dynamically Adaptive Clock Buffers,” IEEE Transactions on Circuits and Systems - I, vol. 56, no. 2, pp. 374-383, February 2009.

  4. Mosin Mondal, Samuel Connor, Bruce Archambeault and Vikram Jandhyala, “Including the Impact of Connecting Vias in the Performance Metric Evaluation for Board-Level Optimization of Decoupling Capacitors”, in Proceedings of IEEE Electrical Performance of Electrical Packaging (EPEP), October 2008.

  5. Mosin Mondal, Samuel Connor, Bruce Archambeault and Vikram Jandhyala, “Fast Frequency Domain Crosstalk Analysis for Board-Level EMC Rule Checking and Optimization,” in Proceedings of IEEE EMC Symposium, August 2008.

  6. Samuel Connor, Bruce Archambeault and Mosin Mondal, “The Impact of Common Mode Currents on Signal Integrity and EMI in High-Speed Differential Data Links,” in Proceedings of IEEE EMC Symposium, August 2008.

  7. Samuel Connor,  Bhyrav Mutnury, Mosin Mondal, Pravin Patel, Jay Diepenbrock, Moises Cases and Bruce Archambeault, “The Impact of Common Mode Currents and Interconnect Inductance on the Signal Quality of Differential Signals in Multi-Board PCB Systems,” in Proceedings of DesignCon, February 2008. (Best Paper Nomination)

  8. Mosin Mondal and Yehia Massoud, “Accurate Analytical Modeling of Frequency Dependent Loop Self-inductance,” Journal of Circuits, Systems, and Computers, vol 17, no. 1, pp. 77-93, February 2008.

 

  1. Mosin Mondal, Bhyrav Mutnury, Pravin Patel, Samuel Connor, Bruce Archambeault and Moises Cases, “Electrical Analysis of Multi-board PCB Systems with Differential Signaling Considering Non-ideal Common Ground Connection,” in Proceedings of IEEE Electrical Performance of Electrical Packaging (EPEP), October 2007. (Best Paper Award)

  2. Sami Kirolos, Mosin Mondal, Kartik Mohanram and Yehia Massoud, “A Model-Based Technique for Efficient Evaluation of Noise Robustness,” in Proceedings of the IEEE International Symposium on Circuits and Systems (MWSCAS), August 2007.

  3. Mosin Mondal and Yehia Massoud, “A Methodology for the Estimation of Capacitive Crosstalk-Induced Short-Circuit Energy,” Journal of Circuits, Systems, and Computers, vol. 16, no. 3, pp. 455-465, June 2007.

  4. Mosin Mondal, Sami Kirolos and Yehia Massoud, “Estimation of Capacitive Crosstalk-Induced Short-Circuit Energy,” in Proceedings of the IEEE International Symposium on Circuits and Systems (ISCAS), May, 2007.

  5. Mosin Mondal, Andrew Ricketts, Sami Kirolos, Tamer Ragheb, Greg Link, Vijaykrishnan Narayanan and Yehia Massoud, “Thermally Robust Clocking Schemes for 3D Integrated Circuits,” in Proceedings of Design Automation and Test in Europe (DATE), April 2007.

  6. Mosin Mondal, Andrew Ricketts, Sami Kirolos, Tamer Ragheb, Greg Link, Vijaykrishnan Narayanan and Yehia Massoud, “Mitigating Thermal Effects on Clock Skew with Dynamically Adaptive Drivers,” in Proceedings of the International Symposium on Quality Electronic Design (ISQED), March 2007.

  7. Mosin Mondal, Kartik Mohanram and Yehia Massoud, “Parameter-Variation-Aware Analysis for Noise Robustness,” in Proceedings of the International Symposium on Quality Electronic Design (ISQED), March 2007.

  8. Mosin Mondal, Xiang Wu, Tamer Ragheb, Adnan Aziz and Yehia Massoud, “Provisioning On-Chip Networks under Buffered RC Interconnect Delay Variations,” in Proceedings of the International Symposium on Quality Electronic Design (ISQED), March 2007.

  9. Arthur Nieuwoudt, Mosin Mondal and Yehia Massoud, “Predicting the Performance and Reliability of Carbon Nanotube Bundles for On-Chip Interconnect,” in Proceedings of the Asia and South Pacific Design Automation Conference (ASPDAC), January 2007.

  10. Mosin Mondal and Yehia Massoud, “Accurate Loop Self Inductance Bound for Efficient Inductance Screening,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 14, no. 12, pp. 1393-1397, December 2006.

  11. Mosin Mondal, Xiang Wu, Adnan Aziz and Yehia Massoud, “Reliability Analysis for On-chip Networks under RC Interconnect Delay Variation”, in Proceedings of the International Conference on Nano-Networks, Lausanne, Switzerland, September 2006.

 

  1. Mosin Mondal and Yehia Massoud, “Reducing Pessimism in RLC Delay Estimation Using an Accurate Analytical Frequency Dependent Model for Inductance”, in Proceedings of IEEE/ACM International Conference on Computer Aided Design (ICCAD), pp. 691-696, November 2005.

  2. Mosin Mondal and Yehia Massoud, “Analytical Modeling of Loop Self Inductance Bound for Inductance-Aware Physical Synthesis”, in Proceedings of IEEE International Symposium on Circuits and Systems (MWSCAS), August 2005.

 

Contributed Book Chapter

 

“Power Integrity Analysis and EMI/EMC” in Power Integrity Analysis and Management for Integrated Circuits, published by Prentice-Hall, May, 2010.

 

Relevant Graduate Level Courses

 

Electromagnetic Computations and Applications

VLSI Design: Theory & Application

Microwave Engineering

Low Power VLSI Design

High Speed Integrated Circuits

VLSI Design: Datapath and Memory

Advanced Numerical Linear Algebra

Design of Phase Locked Loops

Approximation of Dynamical Systems (MOR)

Analog Circuit Design

Random Processes and Applications

Semiconductor Manufacturing


Professional Activities

 

§ Student member, IEEE 2004-2009

§ Reviewer, International Conference on VLSI Design, 2007

§ Reviewer, Design Automation Conference (DAC), 2005, 2006

§ Reviewer, International Symposium on Circuits and Systems (ISCAS), 2006

§ Reviewer, Journal of Circuits, Systems, and Computers (JCSC), 2005, 2006